View BD5323FVETR_7150469.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

www.rohm.com ? 2011 rohm co., ltd. all rights reserved. tsz02201-0r7r0g300040-1-2 tsz22111 ? 14 ? 001 1/10 19.dec.2011 rev.002 datasheet voltage detector ic series free delay time setting cmos voltage detector ic series bd52xx series bd53xx series general description rohm?s bd52xx and bd53xx series are highly accurate, low current consumption reset ic series with a built-in delay circuit. the lineup was established with tow output types (nch open drain and cmos output) and detection voltages range from 2.3v to 6.0v in increments of 0.1v, so that the series may be selected according the application at hand. features ? free delay time setting by external capacitor ? two output types (nch open drain and cmos output) ? ultra-low current consumption ? very small and low height package key specifications ? detection voltage: 2.3v to 6.0v (typ.) 0.1v steps ? high accuracy detection voltage: 1.0% ? ultra-low current consumption: 0.95a (typ.) package ssop5: 2.90mm x 2.80mm x 1.15mm vsof5: 1.60mm x 1.60mm x 0.60mm applications all electronic devices that use micro controllers and logic circuits typical application circuit connection diagram ssop5 vsof5 pin descriptions ssop5 vsof5 pin no. symbol function pin no. symbol function 1 v out reset output 1 v out reset output 2 v dd power supply voltage 2 sub substrate* 3 gnd gnd 3 c t capacitor connection terminal for output delay time 4 n.c. unconnected terminal 4 gnd gnd 5 c t capacitor connection terminal for output delay time 5 v dd power supply voltage *connect the substrate to gnd. open drain output type bd52xx series cmos output type bd53xx series v dd1 bd52xx v dd2 gnd c l (capacitor for noise filtering) c t r l r st micro controller v dd1 bd53xx gnd c t c l (capacitor for noise filtering) r st micro controller top view top view product structure silicon monolithic integrated circuit this product is not designed prot ection against radioactive rays. v out v dd gnd n.c. c t lot. no marking gnd v out sub c t v dd 4 3 2 1 5 marking lot. no
www.rohm.com ? 2011 rohm co., ltd. all rights reserved. tsz02201-0r7r0g300040-1-2 tsz22111 ? 15 ? 001 2/10 19.dec.2011 rev.002 bd52xx series bd53xx series datasheet ordering information b d 5 2 2 3 g t r bd52: adjustable delay time reset voltage value package packaging and forming specification cmos reset ic 23: 2.3v to (0.1v step) g: ssop5 tr: embossed tape and reel open drain type 60: 6.0v fve: vsof5 bd53: adjustable delay time cmos reset ic cmos output type lineup marking detection voltage part number marking detection voltage part number marking detection voltage part number marking detection voltage part number pw 6.0v bd5260 pb 4.1v bd5241 rw 6.0v bd5360 rb 4.1v bd5341 pv 5.9v bd5259 pa 4.0v bd5240 rv 5.9v bd5359 ra 4.0v bd5340 pu 5.8v bd5258 mv 3.9v bd5239 ru 5.8v bd5358 qv 3.9v bd5339 pt 5.7v bd5257 mu 3.8v bd5238 rt 5.7v bd5357 qu 3.8v bd5338 ps 5.6v bd5256 mt 3.7v bd5237 rs 5.6v bd5356 qt 3.7v bd5337 pr 5.5v bd5255 ms 3.6v bd5236 rr 5.5v bd5355 qs 3.6v bd5336 pq 5.4v bd5254 mr 3.5v bd5235 rq 5.4v bd5354 qr 3.5v bd5335 pp 5.3v bd5253 mq 3.4v bd5234 rp 5.3v bd5353 qq 3.4v bd5334 pn 5.2v bd5252 mp 3.3v bd5233 rn 5.2v bd5352 qp 3.3v bd5333 pm 5.1v bd5251 mn 3.2v bd5232 rm 5.1v bd5351 qn 3.2v bd5332 pl 5.0v bd5250 mm 3.1v bd5231 rl 5.0v bd5350 qm 3.1v bd5331 pk 4.9v bd5249 ml 3.0v bd5230 rk 4.9v bd5349 ql 3.0v bd5330 pj 4.8v bd5248 mk 2.9v bd5229 rj 4.8v bd5348 qk 2.9v bd5329 ph 4.7v bd5247 mj 2.8v bd5228 rh 4.7v bd5347 qj 2.8v bd5328 pg 4.6v bd5246 mh 2.7v bd5227 rg 4.6v bd5346 qh 2.7v bd5327 pf 4.5v bd5245 mg 2.6v bd5226 rf 4.5v bd5345 qg 2.6v bd5326 pe 4.4v bd5244 mf 2.5v bd5225 re 4.4v bd5344 qf 2.5v bd5325 pd 4.3v bd5243 me 2.4v bd5224 rd 4.3v bd5343 qe 2.4v bd5324 pc 4.2v bd5242 md 2.3v bd5223 rc 4.2v bd5342 qd 2.3v bd5323 (unit : mm) ssop5 2.90.2 0.13 4 + 6 ?4 1.6 2.80.2 1.10.05 0.050.05 +0.2 ?0.1 +0.05 ?0.03 0.42 +0.05 ?0.04 0.95 5 4 12 3 1.25max. 0.2min. 0.1 direction of feed reel ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tape quantity direction of feed the direction is the 1pin of product is at the upper right when you hold reel on the left hand and you pull out the tape on the right hand 3000pcs tr () 1pin (unit : mm) vsof5 1.2 0.05 4 3 1.0 0.05 1 0.6max 0.22 0.05 0.5 5 1.6 0.05 0.13 0.05 0.2max 2 1.6 0.05 (max 1.28 include burr)
www.rohm.com ? 2011 rohm co., ltd. all rights reserved. tsz02201-0r7r0g300040-1-2 tsz22111 ? 15 ? 001 3/10 19.dec.2011 rev.002 bd52xx series bd53xx series datasheet z absolute maximum ratings (ta=25c) parameter symbol limits unit power supply voltage v dd -gnd -0.3 ~ +10 v nch open drain out put gnd-0.3 ~ +10 output voltage cmos output v out gnd-0.3 ~ v dd +0.3 v ssop5 *1*3 540 power dissipation vsof5 *2*3 pd 210 mw operating temperature topr -40 ~ +105 c ambient storage temperature tstg -55 ~ +125 c *1 use above ta=25c results in a 5.4mw loss per degree. *2 use above ta=25c results in a 2.1mw loss per degree. *3 when a rohm standard circuit board ( 70mm70mm1.6mm glass epoxy board) is mounted. electrical characteristics (unless othe rwise specified ta=-40 to 105c) limit parameter symbol condition min. typ. max. unit detection voltage v det v dd =h ? l, r l =470k ? *1 v det (t) 0.99 v det (t) v det (t) 1.01 v v det =2.3-3.1v - 0.80 2.40 v det =3.2-4.2v - 0.85 2.55 v det =4.3-5.2v - 0.90 2.70 circuit current when on i dd 1 v dd =v det -0.2v v det =5.3-6.0v - 0.95 2.85 a v det =2.3-3.1v - 0.75 2.25 v det =3.2-4.2v - 0.80 2.40 v det =4.3-5.2v - 0.85 2.55 circuit current when off i dd 2 v dd =v det +2.0v v det =5.3-6.0v - 0.90 2.70 a v ol 0.4v, ta=25~105c, r l =470k ? 0.95 - - operating voltage range v opl v ol 0.4v, ta=-40~25c, r l =470k ? 1.20 - - v v ds =0.5v v dd =1.2v 0.4 1.2 - ?low? output current (nch) i ol v ds =0.5v v dd =2.4v 2.0 5.0 - ma v ds =0.5v v dd =4.8v v det =2.3-4.2v 0.7 1.4 - v ds =0.5v v dd =6.0v v det =4.3-5.2v 0.9 1.8 - ?high? output current (pch) i oh v ds =0.5v v dd =8.0v v det =5.3-6.0v 1.1 2.2 - ma leak current when off i leak v dd =v ds =10v *1 - - 0.1 a v dd =v det 1.1, v det =2.3-2.6v, r l =470k ? v dd 0.30 v dd 0.40 v dd 0.60 v dd =v det 1.1, v det =2.7-4.2v, r l =470k ? v dd 0.30 v dd 0.45 v dd 0.60 v dd =v det 1.1, v det =4.3-5.2v, r l =470k ? v dd 0.35 v dd 0.50 v dd 0.60 c t pin threshold voltage v cth v dd =v det 1.1, v det =5.3-6.0v, r l =470k ? v dd 0.40 v dd 0.50 v dd 0.60 v output delay resistance r ct v dd =v det 1.1 v ct =0.5v *1 5.5 9 12.5 m ? v ct =0.1v v dd =0.95v *1 15 40 - c t pin output current i ct v ct =0.5v v dd =1.5v 150 240 - a detection voltage temperature coefficient v det / ? t ta=-40c to 105c - 100 360 ppm/c hysteresis voltage ? v det v dd =l ? h ? l, r l =470k ? v det 0.03 v det 0.05 v det 0.08 v v det (t) : standard detection voltage (2.3v to 6.0v, 0.1v step) r l : pull-up resistor to be connected between v out and power supply. designed guarantee. (outgoing inspection is not done on all products.) *1 guarantee is ta=25c.
www.rohm.com ? 2011 rohm co., ltd. all rights reserved. tsz02201-0r7r0g300040-1-2 tsz22111 ? 15 ? 001 4/10 19.dec.2011 rev.002 bd52xx series bd53xx series datasheet block diagrams vref v out v dd gnd ct vref v out v dd gnd ct fig.1 bd52xx series fig.2 bd53xx series
www.rohm.com ? 2011 rohm co., ltd. all rights reserved. tsz02201-0r7r0g300040-1-2 tsz22111 ? 15 ? 001 5/10 19.dec.2011 rev.002 bd52xx series bd53xx series datasheet typical performance curves fig.3 circuit current 0.0 0.5 1.0 1.5 2.0 01 23 456 78 910 v dd supply voltage v dd [v] circuit current i dd [ a] bd5242g/fve 0 3 6 9 12 15 18 0.0 0.5 1.0 1.5 2.0 2.5 drain-source voltage v ds [v] "low" output current i ol [ma] bd5242g/fve v dd =2.4v v dd =1.2v fig.4 ?low? output current 0 5 10 15 20 25 30 35 40 45 0123456 drain-source voltage v ds [v] "high" output current i oh [ma] bd5342g/fve v dd =8.0v v dd =6.0v v dd =4.8v fig.5 ?high? output current fig.6 i/o characteristics 0 1 2 3 4 5 6 7 8 9 00.5 11.522.5 33.544.5 55.5 v dd supply voltage v dd [v] output voltage v out [v] bd5242g/fve ta=25 ta=25 bd5242 bd5342 bd5342 bd5242 bd5342 bd5242 bd5342
www.rohm.com ? 2011 rohm co., ltd. all rights reserved. tsz02201-0r7r0g300040-1-2 tsz22111 ? 15 ? 001 6/10 19.dec.2011 rev.002 bd52xx series bd53xx series datasheet 0.0 0.2 0.4 0.6 0.8 1.0 0.0 0.5 1.0 1.5 2.0 2.5 v dd supply voltage v dd [v] output voltage v out [v] bd5242g/fve fig.7 operating limit voltage fig.8 ct terminal current 0 50 100 150 200 250 300 350 400 450 012345 v dd supply voltage v dd [v] ct output current i ct [a] bd5242g/fve 3.2 3.6 4.0 4.4 4.8 5.2 5.6 -40 0 40 80 temperature ta[ ] detection voltage v det [v] low to hig h(v det + v det ) high to low(v det ) bd5242g/fve fig.9 detection voltage release voltage 0.0 0.5 1.0 1.5 -40 -20 0 20 40 60 80 100 temperature ta[ ] circuit current when on i dd1 [ a] bd5242g/fve fig.10 circuit current when on bd5242 bd5342 bd5242 bd5342 bd5242 bd5342 bd5242 bd5342
www.rohm.com ? 2011 rohm co., ltd. all rights reserved. tsz02201-0r7r0g300040-1-2 tsz22111 ? 15 ? 001 7/10 19.dec.2011 rev.002 bd52xx series bd53xx series datasheet 0.0 0.5 1.0 1.5 -40 -20 0 20 40 60 80 100 temperature ta[ ] circuit current when off i dd2 [ a] bd5242g/fve fig.11 circuit current when off 0.0 0.5 1.0 1.5 -40-200 20406080100 temperature ta[ ] minimum operating voltage v opl [v] bd5242g/fve fig.12 operating limit voltage 4 5 6 7 8 9 10 11 12 13 -40 -20 0 20 40 60 80 100 temperature ta[ ] resistance of c t r ct [m ? ] bd5242g/fve fig.13 c t terminal circuit resistance 0.1 1 10 100 1000 10000 0.0001 0.001 0.01 0.1 capacitance of c t c ct [ f] delay time t pl h [ms] bd5242g/fve fig.14 delay time (t plh ) and c t terminal external capacitance bd5242 bd5342 bd5242 bd5342 bd5242 bd5342 bd5242 bd5342
www.rohm.com ? 2011 rohm co., ltd. all rights reserved. tsz02201-0r7r0g300040-1-2 tsz22111 ? 15 ? 001 8/10 19.dec.2011 rev.002 bd52xx series bd53xx series datasheet application information explanation of operation for both the open drain type (fig.15) and the cmos output ty pe (fig.16), the detection and release voltages are used as threshold voltages. when the voltage applied to the v dd pins reaches the applicable threshold voltage, the v out terminal voltage switches from either ?high? to ?low? or from ?low? to ?high?. because the bd52xx series uses an open drain output type, it is possible to connect a pull-up resistor to v dd or another power supply [the output ?high? voltage (v out ) in this case becomes v dd or the voltage of the other power supply]. fig.15 (bd52xxtype internal block diagram) fig.16 (bd53xxtype internal block diagram) setting of detector delay time this detector ic can be set delay time at the rise of v dd by the capacitor connected to c t terminal. delay time at the rise of v dd t plh time until when vout rise to 1/2 of v dd after v dd rise up and beyond the release voltage(v det +? v det ) t plh = -c ct r ct ln c ct : c t pin externally attached capacitance r ct : c t pin internal impedance p. 2 r ct refer. v cth : c t pin threshold voltage p. 2 v cth refer. ln : natural logarithm reference data of falling time (t phl ) output examples of falling time (t phl ) output part number t phl [s] -40c t phl [s] ,+25c t phl [s],+105c bd5227 30.8 30 28.8 bd5327 26.8 26 24.8 *this data is for reference only. the figures will vary with the application, so please confirm actual operating conditions before use. timing waveforms example: the following shows the relationship between the input voltage v dd , the c t terminal voltage v ct and the output voltage v out when the input power supply voltage v dd is made to sweep up and sweep down (the circuits are those in fig.15 and 16). 1 when the power supply is turned on, the output is unsettled from after over the operating limit voltage (v opl ) until t phl . there fore it is possible that the reset signal is not outputted when the rise time of v dd is faster than t phl . 2 when v dd is greater than v opl but less than the reset release voltage (v det +?v det ), the c t terminal (v ct ) and output (v out ) voltages will switch to l. 3 if v dd exceeds the reset release voltage (v det +?v det ), then v out switches from l to h (with a delay to the c t terminal). 4 if v dd drops below the detection voltage (v det ) when the power supply is powered down or when there is a power supply fluctuation, v out switches to l (with a delay of t phl ). 5 the potential difference between the detection voltage and the release voltage is known as the hysteresis width ( ?v det ). the system is designed such that the output does not flip-flop with power supply fluctuations within this hysteresis width, preventing malfunctions due to noise vref v dd gnd ct r1 r2 r3 q3 q1 v out reset r l v dd vref v dd gnd ct r1 r2 r3 q3 q2 v out reset q1 v dd v dd -v cth v dd v dd v det + v det v det v opl 0v 1/2 v dd t phl t plh t phl t plh v ct v out fig.17 timing waveform
www.rohm.com ? 2011 rohm co., ltd. all rights reserved. tsz02201-0r7r0g300040-1-2 tsz22111 ? 15 ? 001 9/10 19.dec.2011 rev.002 bd52xx series bd53xx series datasheet circuit applications examples of a common power supply detection reset circuit application examples of bd52xx series (open drain output type) and bd53xx series (cmos output type) are shown below. case1: the power supply of the microcontroller (v dd2 ) differs from the power supply of the reset detection (v dd1 ). use the open drain output type (bd52xx) attached a load resistance (r l ) between the output and v dd2 . (as shown fig.15) case2: the power supply of the microcontroller (v dd1 ) is same as the power supply of the reset detection (v dd1 ). use cmos output type (bd53xx) or open drain output type (bd52xx) attached a load resistance (r l ) between the output and v dd1 . (as shown fig.16) when a capacitance c l for noise filtering is connected to the v out pin (the reset signal input terminal of the microcontroller), please take into account the waveform of the rise and fall of the output voltage (v out ). v dd1 bd52xx v dd2 gnd c l noise-filtering capacitor c t r l r st micro controller fig.18 open drain output type c l noise-filtering capacitor v dd1 bd53xx c t gnd r st micro controller fig.19 cmos output type
www.rohm.com ? 2011 rohm co., ltd. all rights reserved. tsz02201-0r7r0g300040-1-2 tsz22111 ? 15 ? 001 10/10 19.dec.2011 rev.002 bd52xx series bd53xx series datasheet operational notes 1 . absolute maximum range absolute maximum ratings are those values beyond which the life of a device may be destroyed. we cannot be defined the failure mode, such as short mode or open mode. therefore a phy sical security countermeasure, like fuse, is to be given when a specific mode to be beyond absolute maximum ratings is considered. 2 . gnd potential gnd terminal should be a lowest voltage potential every state. please make sure all pins, which are over ground even if, include transient feature. 3 . electrical characteristics be sure to check the electrical characteristics that are o ne the tentative specification will be changed by temperature, supply voltage, and external circuit. 4 . bypass capacitor for noise rejection please put into the capacitor of 1f or more between v dd pin and gnd, and the capacitor of about 1000pf between v out pin and gnd, to reject noise. if extremely big capacitor is used, transient response might be late. please confirm sufficiently for the point. 5 . short circuit between terminal and soldering don?t short-circuit between output pin and v dd pin, output pin and gnd pin, or v dd pin and gnd pin. when soldering the ic on circuit board, please be unusually cautious about the or ientation and the position of the ic. when the orientation is mistaken the ic may be destroyed. 6 . electromagnetic field mal-function may happen when the device is used in the strong electromagnetic field. 7 . the v dd line inpedance might cause oscillation because of the detection current. 8. a v dd -gnd capacitor (as close connection as possible) should be used in high v dd line impedance condition. 9 . lower than the mininum input voltage makes the v out high impedance, and it must be v dd in pull up (v dd ) condition. 10. this ic has extremely high impedance terminals. small leak current due to the uncleanness of pcb surface might cause unexpected operations. application values in these conditions should be selected carefully. if the leakage is assumed between the v out terminal and the gnd terminal, the pull-up resist or should be less than 1/10 of the assumed leak resistance. if 10m ? leakage is assumed between the c t terminal and the gnd terminal, 1m ? connection between the c t terminal and the v dd terminal would be recommended. the value of r ct depends on the external resistor that is connected to c t terminal, so please consider the delay time that is decided by r ct c ct changes. 11. external parameters the recommended parameter range for c t is 100pf~0.1f and rl is 50k ? ~1m ? . there are many factors (board layout, etc) that can affect characteristics. please verify and confirm using practical applications. 12. power on reset operation please note that the power on reset output varies with the v dd rise up time. please verify the actual operation. 13. precautions for board inspection connecting low-impedance capacitors to run inspections wi th the board may produce stress on the ic. therefore, be certain to use proper discharge procedure before each process of the test operation. to prevent electrostatic accumulation and discharge in t he assembly process, thoroughly ground yourself and any equipment that could sustain esd damage, and continue observing esd-prevention procedures in all handing, transfer and storage operations. before attempting to connect components to the test setup, make certain that the power supply is off. likewise, be sure the power supply is off before removing any component connected to the test setup. 14. when the power supply, is turned on because of in certain cases, momentary rash-current flow into the ic at the logic unsettled, the couple capacitance, gnd pattern of width and leading line must be considered. status of this document the japanese version of this document is formal specification. a customer may use this translation version only for a reference to help reading the formal version. if there are any differences in translation version of this document formal version takes priority.
datasheet datasheet notice - rev.001 notice precaution for circuit design 1) the products are designed and produced for applicatio n in ordinary electronic equipment (av equipment, oa equipment, telecommunication equipment, home appliances, amusement equipment, etc.). if the products are to be used in devices requiring extremel y high reliability (medical equipment, transport equipment, aircraft/spacecraft, nuclear power controllers, fuel contro llers, car equipment including car accessories, safety devices, etc.) and whose malfunction or operational error may endanger human life and sufficient fail-safe measures, please consult with the rohm sales staff in advance. if product malfunctions may re sult in serious damage, including that to human life, sufficient fail-safe measures must be taken, including the following: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits in the case of single-circuit failure 2) the products are designed for use in a standard environment and not in any spec ial environments. a pplication of the products in a special environment can deteriorate product per formance. accordingly, verification and confirmation of product performance, prior to use, is recomm ended if used under the following conditions: [a] use in various types of liquid, includin g water, oils, chemicals, and organic solvents [b] use outdoors where the products are exposed to direct sunlight, or in dusty places [c] use in places where the products are exposed to sea winds or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use in places where the products are exposed to static electricity or electromagnetic waves [e] use in proximity to heat-producing componen ts, plastic cords, or other flammable items [f] use involving sealing or coating the prod ucts with resin or other coating materials [g] use involving unclean solder or use of water or water-soluble cleaning agents for cleaning after soldering [h] use of the products in places subject to dew condensation 3) the products are not radiation resistant. 4) verification and confirmation of performance characte ristics of products, after on- board mounting, is advised. 5) in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse) is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 6) de-rate power dissipation (pd) depending on ambient temperature (ta). when used in sealed area, confirm the actual ambient temperature. 7) confirm that operation temper ature is within the specified range described in product specification. 8) failure induced under deviant condition from what def ined in the product specific ation cannot be guaranteed. precaution for mounting / circuit board design 1) when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the remainder of fl ux may negatively affect product performance and reliability. 2) in principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the company in advance. regarding precaution for mounting / circu it board design, please specially refe r to rohm mounting specification precautions regarding application examples and external circuits 1) if change is made to the constant of an external circuit, allow a sufficient margin due to variations of the characteristics of the products and external components, including transient characteristics, as well as static characteristics. 2) the application examples, their const ants, and other types of information cont ained herein are applicable only when the products are used in accordance with standard methods . therefore, if mass production is intended, sufficient consideration to external conditions must be made.
datasheet datasheet notice - rev.001 precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution during manufacturing and st oring so that voltage exceeding product ma ximum rating won't be applied to products. please take special care under dry condition (e.g. grounding of human body / equipment / so lder iron, isolation from charged objects, setting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1) product performance and soldered connections may deteriorate if the products are stored in the following places: [a] where the products are exposed to sea winds or corrosive gases, including cl2, h2s, nh3, so2, and no2 [b] where the temperature or humidity exceeds those recommended by the company [c] storage in direct sunshine or condensation [d] storage in high electrostatic 2) even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding recommended storage time period . 3) store / transport cartons in the correct direction, whic h is indicated on a carton as a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4) use products within the specified time after opening a dry bag. precaution for product label qr code printed on rohm product label is only for internal us e, and please do not use at cust omer site. it might contain a internal part number that is inconsistent with an product part number. precaution for disposition when disposing products please dispose them properly with a industry waste company. precaution for foreign exchange and foreign trade act since concerned goods might be fallen under controlled goods prescribed by foreign exchange and foreign trade act, please consult with rohm in case of export. prohibitions regarding industrial property 1) information and data on products, including application exam ples, contained in these specifications are simply for reference; the company does not guarantee any industrial pr operty rights, intellectual property rights, or any other rights of a third party regarding this information or data. ac cordingly, the company does not bear any responsibility for: [a] infringement of the intellectual property rights of a third party [b] any problems incurred by the use of the products listed herein. 2) the company prohibits the purchaser of its products to exercise or use the in tellectual property rights, industrial property rights, or any other rights that either belong to or are controlled by the company, other than the right to use, sell, or dispose of the products.

▲Up To Search▲

Price & Availability of BD5323FVETR

	To Download BD5323FVETR Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .